ADVANCING DIFFUSION BONDED COMPACT HEAT EXCHANGERS FOR HIGH TEMPERATURE APPLICATIONS

Mohamed Elbakhshwan, Lukas Desorcy, Ian Jentz, Mark Anderson, Fei Gao, Todd Allen, Mark Messner, Mike McMurtrey, Jim Stubbins, John Shingledecker, Billy Nollet, Bob Keating

Research output: Contribution to specialist publicationArticle

Abstract

Enhancement of the diffusion bonding process for the development of compact heat exchangers provides an energy efficient solution for high temperature applications in advanced nuclear reactors and other technologies.

Original languageEnglish
Pages14-18
Number of pages5
Volume181
No4
Specialist publicationAdvanced Materials and Processes
StatePublished - May 2023

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