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Thermal design of an advanced multichip module for a RISC processor
A. Garg
, T. L. Sham
, H. Greub
, J. Loy
, J. F. McDonald
Research output
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peer-review
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Keyphrases
Thermal Design
100%
RISC Processor
100%
Multichip Modules
100%
Gallium Arsenide
50%
High Bandwidth
50%
High Power
25%
High Density
25%
Attracting Attention
25%
Low Power
25%
Thermally Stable
25%
Heat Conduction
25%
Circuit Application
25%
Thermal Simulation
25%
Insulator
25%
Power Consumption
25%
Heterojunction Bipolar Transistors
25%
Maximum Heat Flux
25%
Integration Level
25%
Low Dielectric Constant
25%
AlGaAs
25%
Multiple chips
25%
Stable Module
25%
32-bit
25%
Multilayer Substrate
25%
Parylene
25%
Full Differential
25%
Interchip
25%
Differential Current
25%
Module Technology
25%
Fine pitch
25%
Transistor Technology
25%
Current Mode Logic
25%
N-of-1
25%
Engineering
Multichip Modules
100%
Gallium Arsenide
50%
Simulation Result
25%
Interconnects
25%
Dielectrics
25%
Electric Power Utilization
25%
Maximum Heat Flux
25%
Thermal Simulation
25%
Aluminium Gallium Arsenide
25%
Heterojunction bipolar transistors
25%