Skip to main navigation Skip to search Skip to main content

The flow stress behavior of OFHC polycrystalline copper

  • J. E. Flinn
  • , D. P. Field
  • , G. E. Korth
  • , T. M. Lillo
  • , J. Macheret

Research output: Contribution to journalArticlepeer-review

69 Scopus citations

Abstract

The flow stress behavior of OFHC polycrystalline copper was evaluated using cold-rolled and equal channel angular extruded materials. Prior to tensile testing at room temperature, the specimens were heat treated to obtain grain sizes ranging from 3 to 60 μm. The flow stress, when correlated with the square root of true strain, is associated with four stages of hardening. These stages, in terms of increasing strain, are attributed to: (1) dislocation source activation, possibly at annealing twin boundaries during the onset of plastic flow, (2) dislocation slip and cross slip, (3) constriction of the screw dislocation partials for cross slip continuation, and (4) dislocation annihilation and saturation as interpreted through dynamic recovery. The tensile properties and analyses are supported by observations and measurements from orientation imaging and transmission electron microscopy.

Original languageEnglish
Pages (from-to)2065-2074
Number of pages10
JournalActa Materialia
Volume49
Issue number11
DOIs
StatePublished - Jun 22 2001

Keywords

  • Copper
  • Dislocations
  • Grain boundaries
  • Stress-strain relationship measurements
  • Transmission electron microscopy (TEM)

Fingerprint

Dive into the research topics of 'The flow stress behavior of OFHC polycrystalline copper'. Together they form a unique fingerprint.

Cite this