System configured for applying a modifying agent to a non-equidimensional substrate

Stuart K. Janikowski; Mark D. Argyle; Robert V. Fox; W Alan Propp; William J. Toth; Daniel M. Ginosar; Charles A. Allen; L Miller David

System configured for applying a modifying agent to a non-equidimensional substrate

Stuart K. Janikowski (Inventor), Mark D. Argyle (Inventor), Robert V. Fox (Inventor), W Alan Propp (Inventor), William J. Toth (Inventor), Daniel M. Ginosar (Inventor), Charles A. Allen (Inventor), L Miller David (Inventor)

Research output: Patent

Abstract

The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.

Original language	American English
Patent number	7241340
State	Published - Jul 2007

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@misc{787d206e74ae4199aa842c488e5b3ecc,

title = "System configured for applying a modifying agent to a non-equidimensional substrate",

abstract = "The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.",

author = "Janikowski, {Stuart K.} and Argyle, {Mark D.} and Fox, {Robert V.} and Propp, {W Alan} and Toth, {William J.} and Ginosar, {Daniel M.} and Allen, {Charles A.} and {Miller David}, L",

note = "M1 - 7241340; 7241340",

year = "2007",

month = jul,

language = "American English",

type = "Patent",

}

TY - PAT

T1 - System configured for applying a modifying agent to a non-equidimensional substrate

AU - Janikowski, Stuart K.

AU - Argyle, Mark D.

AU - Fox, Robert V.

AU - Propp, W Alan

AU - Toth, William J.

AU - Ginosar, Daniel M.

AU - Allen, Charles A.

AU - Miller David, L

N1 - M1 - 7241340

PY - 2007/7

Y1 - 2007/7

N2 - The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.

AB - The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.

M3 - Patent

M1 - 7241340

ER -

System configured for applying a modifying agent to a non-equidimensional substrate

Abstract

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