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Residual internal stress optimization for EPON 828/DEA thermoset resin using fiber Bragg grating sensors

  • Garth D. Rohr
  • , Roger D. Rasberry
  • , Amy K. Kaczmarowski
  • , Mark E. Stavig
  • , Cory S. Gibson
  • , Eric Udd
  • , Allen R. Roach
  • , Brendan Nation

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Internal residual stresses and overall mechanical properties of thermoset resins are largely dictated by the curing process. It is well understood that fiber Bragg grating (FBG) sensors can be used to evaluate temperature and cure induced strain while embedded during curing. Herein, is an extension of this work whereby we use FBGs as a probe for minimizing the internal residual stress of an unfilled and filled Epon 828/DEA resin. Variables affecting stress including cure cycle, mold (release), and adhesion promoting additives will be discussed and stress measurements from a strain gauge pop-off test will be used as comparison. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000.

Original languageEnglish
Title of host publicationFiber Optic Sensors and Applications XII
EditorsHenry H. Du, Gary Pickrell, Eric Udd
PublisherSPIE
ISBN (Electronic)9781628415964
DOIs
StatePublished - 2015
EventFiber Optic Sensors and Applications XII - Baltimore, United States
Duration: Apr 22 2015Apr 23 2015

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9480
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceFiber Optic Sensors and Applications XII
Country/TerritoryUnited States
CityBaltimore
Period04/22/1504/23/15

Keywords

  • Fiber Bragg grating
  • chirped
  • cure
  • encapsulation
  • epoxy
  • stress

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