Prediction Of thermal boundary conductance at the interface with phonon wave-packet simulations: The roles of vibrational spectra differences, interface bond strength, and inelastic scattering

Chang Jin Choi, W. Tanner Yorgason, Nicholas A. Roberts

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The current study uses phonon wave-packet simulations and calculates the phonon transmission rate to explore the contribu-Tions of the mass and the bond energy differences on the ther- mal boundary conductance at the interface between two dissim- ilar materials. The impact of interdiffusion and interface bond strength on the thermal boundary conductance are also stud- ied. Results show that the difference in mass and bond energy of materials results in a difference in phonon dispersion rela-Tions. Thus the frequency dependence of phonon transmission rate is observed at the interface. The interdiffusion allows high frequency phonons to contribute to phonon energy transport by inelastically scattering into multiple lower frequency phonons. Therefore the different energy distribution at the interface is ob- served for different wavevectors when there is interdiffusion be-Tween two materials which results in increased strain at the in-Terface. It is also found that applying different bond strengths has little effect on thermal boundary conductance at the interface unless this interface bond strength deviates significantly from the commonly used mixing rules.

Original languageEnglish
Title of host publicationHeat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791850329
DOIs
StatePublished - 2016
EventASME 2016 Heat Transfer Summer Conference, HT 2016, collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels - Washington, United States
Duration: Jul 10 2016Jul 14 2016

Publication series

NameASME 2016 Heat Transfer Summer Conference, HT 2016, collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels
Volume1

Conference

ConferenceASME 2016 Heat Transfer Summer Conference, HT 2016, collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels
Country/TerritoryUnited States
CityWashington
Period07/10/1607/14/16

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