TY - GEN
T1 - Plasma Jet Printing for Flexible Hybrid Electronics-A Review (Invited Paper)
AU - Manzi, Jacob
AU - Estrada, David
AU - Subbaraman, Harish
N1 - Funding Information:
The authors acknowledge support EPSCoR (grant # 80NSSC19M0151).
Publisher Copyright:
© 2023 IEEE.
PY - 2023/9/25
Y1 - 2023/9/25
N2 - Plasma jet printing has been utilized in the area of additive manufacturing for flexible hybrid electronics. The advantages of PJP-gravity-independent deposition, in situ material tailoring, ability to fabricate on low-Temperature substrates, and increased adhesion are discussed as they relate to the goals of the technology.
AB - Plasma jet printing has been utilized in the area of additive manufacturing for flexible hybrid electronics. The advantages of PJP-gravity-independent deposition, in situ material tailoring, ability to fabricate on low-Temperature substrates, and increased adhesion are discussed as they relate to the goals of the technology.
KW - Additive manufacturing
KW - adhesion
KW - flexible hybrid electronics
KW - plasma jet printing
KW - self-sintering
UR - https://www.scopus.com/pages/publications/85174388483
UR - https://www.mendeley.com/catalogue/1a6f76b1-e7a7-32f4-969d-9af12995e207/
U2 - 10.1109/IFETC57334.2023.10254821
DO - 10.1109/IFETC57334.2023.10254821
M3 - Conference contribution
AN - SCOPUS:85174388483
SN - 9798350332094
T3 - IFETC 2023 - 5th IEEE International Flexible Electronics Technology Conference, Proceedings
BT - IFETC 2023 - 5th IEEE International Flexible Electronics Technology Conference, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th IEEE International Flexible Electronics Technology Conference, IFETC 2023
Y2 - 13 August 2023 through 16 August 2023
ER -