Skip to main navigation Skip to search Skip to main content

Methodology for the integration of global/local thermal and thermo-mechanical analyses of multichip modules

  • M. S. Shephard
  • , P. L. Baehmann
  • , Y. L. Le Coz
  • , T. L. Sham

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Fingerprint

Dive into the research topics of 'Methodology for the integration of global/local thermal and thermo-mechanical analyses of multichip modules'. Together they form a unique fingerprint.
Sort by

Keyphrases

Engineering