Methodology for the integration of global/local thermal and thermo-mechanical analyses of multichip modules

M. S. Shephard; P. L. Baehmann; Y. L. Le Coz; T. L. Sham

Methodology for the integration of global/local thermal and thermo-mechanical analyses of multichip modules

M. S. Shephard
, P. L. Baehmann
, Y. L. Le Coz
, T. L. Sham

Nuclear Reactor Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper considers the integration of the global and local analysis procedures required to effectively perform thermal and thermomechanical analyses of multichip modules (MCM). Multichip interconnects are complex three-dimensional objects constructed of a number of substrate layers with embedded wires which are interconnected from layer to layer to make the appropriate electrical connections. Emphasis is placed on the overall methodology and computational techniques needed to support this integration in a seamless environment. The specific procedures being put in place to support the integration of the analysis procedures are outlined.

Original language	English
Title of host publication	Computer Aided Design in Electronic Packaging
Publisher	Publ by ASME
Pages	65-72
Number of pages	8
ISBN (Print)	0791811271
State	Published - 1992
Event	Winter Annual Meeting of the American Society of Mechanical Engineers - Anaheim, CA, USA Duration: Nov 8 1992 → Nov 13 1992

Publication series

Name	American Society of Mechanical Engineers, EEP
Volume	3

Conference

Conference	Winter Annual Meeting of the American Society of Mechanical Engineers
City	Anaheim, CA, USA
Period	11/8/92 → 11/13/92

Cite this

@inproceedings{c7f24742033f4e798398d0de2209f3a7,

title = "Methodology for the integration of global/local thermal and thermo-mechanical analyses of multichip modules",

abstract = "This paper considers the integration of the global and local analysis procedures required to effectively perform thermal and thermomechanical analyses of multichip modules (MCM). Multichip interconnects are complex three-dimensional objects constructed of a number of substrate layers with embedded wires which are interconnected from layer to layer to make the appropriate electrical connections. Emphasis is placed on the overall methodology and computational techniques needed to support this integration in a seamless environment. The specific procedures being put in place to support the integration of the analysis procedures are outlined.",

author = "Shephard, \{M. S.\} and Baehmann, \{P. L.\} and \{Le Coz\}, \{Y. L.\} and Sham, \{T. L.\}",

year = "1992",

language = "English",

isbn = "0791811271",

series = "American Society of Mechanical Engineers, EEP",

publisher = "Publ by ASME",

pages = "65--72",

booktitle = "Computer Aided Design in Electronic Packaging",

note = "Winter Annual Meeting of the American Society of Mechanical Engineers ; Conference date: 08-11-1992 Through 13-11-1992",

}

Shephard, MS, Baehmann, PL, Le Coz, YL & Sham, TL 1992, Methodology for the integration of global/local thermal and thermo-mechanical analyses of multichip modules. in Computer Aided Design in Electronic Packaging. American Society of Mechanical Engineers, EEP, vol. 3, Publ by ASME, pp. 65-72, Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, CA, USA, 11/8/92.

Methodology for the integration of global/local thermal and thermo-mechanical analyses of multichip modules. / Shephard, M. S.; Baehmann, P. L.; Le Coz, Y. L. et al.
Computer Aided Design in Electronic Packaging. Publ by ASME, 1992. p. 65-72 (American Society of Mechanical Engineers, EEP; Vol. 3).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Methodology for the integration of global/local thermal and thermo-mechanical analyses of multichip modules

AU - Shephard, M. S.

AU - Baehmann, P. L.

AU - Le Coz, Y. L.

AU - Sham, T. L.

PY - 1992

Y1 - 1992

N2 - This paper considers the integration of the global and local analysis procedures required to effectively perform thermal and thermomechanical analyses of multichip modules (MCM). Multichip interconnects are complex three-dimensional objects constructed of a number of substrate layers with embedded wires which are interconnected from layer to layer to make the appropriate electrical connections. Emphasis is placed on the overall methodology and computational techniques needed to support this integration in a seamless environment. The specific procedures being put in place to support the integration of the analysis procedures are outlined.

AB - This paper considers the integration of the global and local analysis procedures required to effectively perform thermal and thermomechanical analyses of multichip modules (MCM). Multichip interconnects are complex three-dimensional objects constructed of a number of substrate layers with embedded wires which are interconnected from layer to layer to make the appropriate electrical connections. Emphasis is placed on the overall methodology and computational techniques needed to support this integration in a seamless environment. The specific procedures being put in place to support the integration of the analysis procedures are outlined.

UR - https://www.scopus.com/pages/publications/0026965928

M3 - Conference contribution

AN - SCOPUS:0026965928

SN - 0791811271

T3 - American Society of Mechanical Engineers, EEP

SP - 65

EP - 72

BT - Computer Aided Design in Electronic Packaging

PB - Publ by ASME

T2 - Winter Annual Meeting of the American Society of Mechanical Engineers

Y2 - 8 November 1992 through 13 November 1992

ER -

Methodology for the integration of global/local thermal and thermo-mechanical analyses of multichip modules

Abstract

Publication series

Conference

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