Global/local analyses of multichip modules: automated 3-D model construction and adaptive finite element analysis

M. S. Shephard; T. L. Sham; L. Y. Song; V. S. Wong; R. Garimella; H. F. Tiersten; B. J. Lwo; Y. L. Le Coz; R. B. Iverson

Global/local analyses of multichip modules: automated 3-D model construction and adaptive finite element analysis

M. S. Shephard
, T. L. Sham
, L. Y. Song
, V. S. Wong
, R. Garimella
, H. F. Tiersten
, B. J. Lwo
, Y. L. Le Coz
, R. B. Iverson

Nuclear Reactor Technology

Research output: Contribution to conference › Paper › peer-review

3 Scopus citations

Abstract

This paper overviews a set of software procedures for the efficient global and local thermal and thermomechanical analysis of multichip modules. This paper emphasizes the automatic construction of the numerical analysis models form a CIF file specification and the use of automated adaptive finite element methods for the local thermomechanical analysis.

Original language	English
Pages	39-48
Number of pages	10
State	Published - 1993
Event	Proceedings of the 1993 ASME International Electronics Packaging Conference - Binghamton, NY, USA Duration: Sep 29 1993 → Oct 2 1993

Conference

Conference	Proceedings of the 1993 ASME International Electronics Packaging Conference
City	Binghamton, NY, USA
Period	09/29/93 → 10/2/93

Cite this

Shephard, M. S., Sham, T. L., Song, L. Y., Wong, V. S., Garimella, R., Tiersten, H. F., Lwo, B. J., Le Coz, Y. L., & Iverson, R. B. (1993). Global/local analyses of multichip modules: automated 3-D model construction and adaptive finite element analysis. 39-48. Paper presented at Proceedings of the 1993 ASME International Electronics Packaging Conference, Binghamton, NY, USA.

@conference{b01d7d4c219644d190f2a83fea46226b,

title = "Global/local analyses of multichip modules: automated 3-D model construction and adaptive finite element analysis",

abstract = "This paper overviews a set of software procedures for the efficient global and local thermal and thermomechanical analysis of multichip modules. This paper emphasizes the automatic construction of the numerical analysis models form a CIF file specification and the use of automated adaptive finite element methods for the local thermomechanical analysis.",

author = "Shephard, \{M. S.\} and Sham, \{T. L.\} and Song, \{L. Y.\} and Wong, \{V. S.\} and R. Garimella and Tiersten, \{H. F.\} and Lwo, \{B. J.\} and \{Le Coz\}, \{Y. L.\} and Iverson, \{R. B.\}",

year = "1993",

language = "English",

pages = "39--48",

note = "Proceedings of the 1993 ASME International Electronics Packaging Conference ; Conference date: 29-09-1993 Through 02-10-1993",

}

Shephard, MS, Sham, TL, Song, LY, Wong, VS, Garimella, R, Tiersten, HF, Lwo, BJ, Le Coz, YL & Iverson, RB 1993, 'Global/local analyses of multichip modules: automated 3-D model construction and adaptive finite element analysis', Paper presented at Proceedings of the 1993 ASME International Electronics Packaging Conference, Binghamton, NY, USA, 09/29/93 - 10/2/93 pp. 39-48.

TY - CONF

T1 - Global/local analyses of multichip modules

T2 - Proceedings of the 1993 ASME International Electronics Packaging Conference

AU - Shephard, M. S.

AU - Sham, T. L.

AU - Song, L. Y.

AU - Wong, V. S.

AU - Garimella, R.

AU - Tiersten, H. F.

AU - Lwo, B. J.

AU - Le Coz, Y. L.

AU - Iverson, R. B.

PY - 1993

Y1 - 1993

N2 - This paper overviews a set of software procedures for the efficient global and local thermal and thermomechanical analysis of multichip modules. This paper emphasizes the automatic construction of the numerical analysis models form a CIF file specification and the use of automated adaptive finite element methods for the local thermomechanical analysis.

AB - This paper overviews a set of software procedures for the efficient global and local thermal and thermomechanical analysis of multichip modules. This paper emphasizes the automatic construction of the numerical analysis models form a CIF file specification and the use of automated adaptive finite element methods for the local thermomechanical analysis.

UR - https://www.scopus.com/pages/publications/0027762962

M3 - Paper

AN - SCOPUS:0027762962

SP - 39

EP - 48

Y2 - 29 September 1993 through 2 October 1993

ER -

Global/local analyses of multichip modules: automated 3-D model construction and adaptive finite element analysis

Abstract

Conference

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