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Global-local procedure for the heat conduction analysis of multichip modules
T. L. Sham, H. F. Tiersten, P. L. Baehmann, L. Y. Song, Y. S. Zhou, B. J. Lwo, Y. L. LeCoz, M. S. Shephard
Research output: Contribution to conference › Paper › peer-review
6
Scopus
citations