Abstract
A global-local procedure for the determination of the temperature field in particularly critical regions of multichip modules is presented. In this procedure, a simpler global problem is defined where layers in the multichip module, which contain metal wires and polymer, are represented as homogeneous effective continua. The global problem is solved by means of a new variational approximation procedure which is particularly well-suited to layered structures because the number of algebraic equations to be solved does not increase with the number of layers. The temperature field obtained from this global problem is imposed as boundary data on the surface surrounding a critical local region. This local solution is found by means of an adaptive finite element method in which all material constituents and discrete geometry are included. The treatment of a relatively simple three-layer structure with the middle layer containing metal wires and polymer, which can readily be treated by the adaptive finite element method, reveals that the global-local method accurately predicts the local solution. It is also shown that the solution of the global problem obtained by the new variational approximation procedure is very accurate when compared with the corresponding finite element solution.
| Original language | English |
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| Pages | 551-562 |
| Number of pages | 12 |
| State | Published - 1993 |
| Externally published | Yes |
| Event | Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2) - Binghamton, NY, USA Duration: Sep 29 1993 → Oct 2 1993 |
Conference
| Conference | Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2) |
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| City | Binghamton, NY, USA |
| Period | 09/29/93 → 10/2/93 |