Abstract
A potted electronic device comprises an electronic device at least partially encapsulated by an energetic potting material. The energetic potting material comprises a halogenated urethane binder and a metal fuel dispersed within the halogenated urethane binder. Related energetic potting materials and methods of forming electronic devices at least partially encapsulated with the energetic potting materials are also disclosed.
| Original language | American English |
|---|---|
| Patent number | 10,042,397 |
| State | Published - Aug 2018 |
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