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Characterization of microstructured semiconductor neutron detectors

  • S. L. Bellinger
  • , B. W. Cooper
  • , R. G. Fronk
  • , L. Henson
  • , T. Ochs
  • , T. J. Sobering
  • , D. S. McGregor

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

10 Scopus citations

Abstract

Silicon diodes with large aspect ratio microstructures backfilled with neutron-reactive material show a dramatic increase in neutron-detection efficiency beyond that of conventional thin-film coated planar devices. Described here are advancements in applications of the technology. The highest single-chip efficiency devices thus far have delivered over 30.1% intrinsic thermal-neutron detection efficiency at normal incident, and 37.6% at a 45° incident. The detectors operate as diffused pn-junction diodes each having 4-cm2 active area. The solid-state silicon device operates on zero to 2.7V and utilizes simple signal amplification and counting electronic components. The intrinsic detection-efficiency for normal-incident 0.0253 eV neutrons was found for the detectors by calibrating against a calibrated 3He proportional counter.

Original languageEnglish
Title of host publication2013 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2013
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479905348
DOIs
StatePublished - 2013
Event2013 60th IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2013 - Seoul, Korea, Republic of
Duration: Oct 27 2013Nov 2 2013

Publication series

NameIEEE Nuclear Science Symposium Conference Record
ISSN (Print)1095-7863

Conference

Conference2013 60th IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2013
Country/TerritoryKorea, Republic of
CitySeoul
Period10/27/1311/2/13

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