Abstract
Enhancement of the diffusion bonding process for the development of compact heat exchangers provides an energy efficient solution for high temperature applications in advanced nuclear reactors and other technologies.
| Original language | English |
|---|---|
| Pages | 14-18 |
| Number of pages | 5 |
| Volume | 181 |
| No | 4 |
| Specialist publication | Advanced Materials and Processes |
| State | Published - May 2023 |
Fingerprint
Dive into the research topics of 'ADVANCING DIFFUSION BONDED COMPACT HEAT EXCHANGERS FOR HIGH TEMPERATURE APPLICATIONS'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver